Profile Extrusion Package

The COMPUPLAST® Profile Extrusion Package™ can help the user visualize the material behavior anywhere inside the process. It also allows for adjustment of the die geometry to get balanced flow inside the die to achieve the desired material distribution at the die exit.

This package can be used for the design and/or optimization of virtually any profile extrusion process including coextruded profiles. It can be used to develop optimized profile dies for maximum production rate, estimate extruder performance and to optimize calibration and cooling systems.

The die flow balancing can be performed either manually or with an optional Automatic Flow Balancing™ feature, which automatically finds the shape of the die channels that optimizes the material distribution throughout the die.

The COMPUPLAST® Virtual Extrusion Laboratory™ for Profile Extrusion consists of several modules that can be purchased individually, or in combination, to simulate the various components in a Profile Extrusion Process.

The applicable VEL™ Modules in Profile Extrusion Process are:

• Material Properties
• Profile Die
• Cooling
• 3D FEM

• The VEL™ Profile Extrusion Package can help the user understand/solve the following problems:
  • unbalanced flow
  • poor surface quality
  • poor final thickness distribution
  • die sensitivity on process conditions changes
  • profile deformation (bending, warping) during cooling
  • problems related to the extruder

The Profile Extrusion Package can also show how efficiently and evenly (or unevenly) the profile is cooled and if there is a tendency for bending or warping during cooling.